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Selected work.
A cross-section of boards and products I have developed — shown by technology and constraint, not by customer.
NDA-friendly
Customer names and product details stay confidential. More detail is available on request, where agreements allow.
L1L2L3L4L5L6L7L8
µvia L1–2 · L2–3 · L6–7 · L7–8 · through
HDI
8-layer HDI, 2+4+2 microvia build-up
Via strategy optimised for manufacturing lead time: no buried vias, microvia pairs on both outer sides, rules aligned with the fab’s capabilities.
- Layers8
- MicroviasL1–2, L2–3, L6–7, L7–8
- Through vias0.2 / 0.25 / 0.3 mm drill
- ToolAltium Designer
non-ISISsegregationIEC 60079-11
ATEX / IECEx
Explosion-protected industrial devices
Hardware and PCB development for explosion-protected (Ex) products, where spacing and segregation are part of the certification evidence.
- FieldHazardous areas (Ex)
- StandardsIEC 60079 series
- RoleHardware & PCB development
- Period2019 – 2023
Handset
MCU
Driver circuit
Motor
Actuators
Actuator control electronics
Electronic control systems, handsets and actuators — from concept through test procedures to series production.
- FieldElectric actuators
- ScopeHardware, software, testing
- StageConcept → series
- Period2011 – 2019
Your board could be next.
Send the constraints — I’ll come back with an honest assessment and a quote.